Functional AgFlake

Functional Agflake is thin borosilicate platelets encapsulated in high loadings of pure silver, Functional AgFlake is used for functional purposes as a conductive filler. In contrast to equivalent pure metal fillers, Functional Agflake provides conductivity at a lower cost, is lightweight by comparison, and high conductivity can be achieved at low loading.


  • High conductivity even at low loadings
  • High surface area additive
  • Lower density than pure metal flakes
  • Lower cost than pure silver flakes
  • Free flowing flakes, easy to process
  • Inherent leafing behaviour
  • High thermal stability
  • Ag oxidation does not adversely affect conductivity
Product CodeNominal Flake ThicknessPSD (µm)TDSMSDS
GFEAGF-40351.31 - 2.3µmAvg. 40
GFEAGF-20351.31 - 2.3µmAvg. 20
GFEAGF-20301.31 - 2.3µmAvg. 20
Product RangePSD (µm)Powder volume resistivity @ 15% RH
(BS 5958:Part 1:1991 and BS 7506:Part 2 :1996)
AgFlake 2030209.4x10-1 Ωm
AgFlake 2035201.6x10-1 Ωm
AgFlake 4035404.8x10-1 Ωm

The dimensions currently offered within the range of Functional AgFlake products is designed to offset to many pure silver flake fillers currently on the market, with the benefits of lower cost, due to the glass core of these flakes. The glass core also contributes to reduced overall density of the flakes in use, this offers further applications into lightweight electronics such as the emerging wearable technology sector, as well as into aerospace materials.
As the manufacturer of the glass core, used to produce these conductive additives, Glassflake has the ability to manipulate the morphology of the glass substrate and therefore sizes of the Functional AgFlake. Changes to the flakes sizes can be beneficial in applications where higher conductivity is required and this can be achieved with a thinner and higher diameter flake to increase the available silver surface area for conductivity.


  • Conductive adhesives (ACA, ICA)
  • Conductive films (ACF, ICF)
  • Conductive compounds
  • Conductive Inks
  • EMI/RMI shielding
  • 3D printing
  • Static dissipation